Method of making a test probe ring

Details Method of making a test probe ring Method of making a test probe ring

1995-02-03

1996-02-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29825, 1566301, 1566441, 1566571, 15665911, 437 8, H01R 900

Patent

active

054918910

ABSTRACT:
A test probe ring for semiconductor devices is disclosed which contains a ground plane layer, an insulating layer and a layer of electrically separate conductors. A centrally located opening in the layered assembly has a plurality of layered fingers carrying the inner ends of the conductors. A pattern of contact bumps on the free ends of the fingers provides a co-planar pattern of conductor contacts which match a pattern of semiconductor device test pads. The fingers and contacts are formed by cutting kerfs between the conductors at the periphery of the centrally located opening.

REFERENCES:
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patent: 4329642 (1982-05-01), Luthi et al.
patent: 4411719 (1983-10-01), Lindberg
patent: 4783719 (1988-11-01), Jamison et al.
patent: 5103557 (1992-04-01), Leady
patent: 5131852 (1992-07-01), Grabbe

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