Method of making a surface mountable semiconductor device...

Details Method of making a surface mountable semiconductor device... Method of making a surface mountable semiconductor device...

2005-05-10

2005-05-10

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000

Reexamination Certificate

active

06890797

ABSTRACT:
The invention relates to the manufacture of a semiconductor device (10) which is suitable for surface mounting of a semiconductor body (1) provided with connection regions (2) for, for example, a diode.In a method, a flexible foil (6) comprises a conductor pattern (4) and an insulating layer (3), and is detachably secured, on the side of the conductor pattern (4), to a substrate (7).

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patent: 0260490 (1987-08-01), None

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