Method of making a support for light emitting diodes which...

Details Method of making a support for light emitting diodes which... Method of making a support for light emitting diodes which...

2008-09-09

2008-09-09

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S023000, C438S042000, C257SE33001, C257SE27120

Reexamination Certificate

active

11286161

ABSTRACT:
The present invention relates to a method of making supports for light emitting diodes, wherein rigid substrates are used as supports for light emitting diodes, it being proposed, in particular, to render the substrates more fragile in order to make certain zones of a lower layer of the said substrate more flexible so that the substrate is able to deform in the region of the zones thus made flexible, the deformation then taking place without causing the electrical conduction of a top layer, on which the diodes are disposed, to be broken. In one particular embodiment of the invention it is proposed to provide as many rigid substrate plates as there are support planes in the three-dimensional environment, and to connect these various substrate plates together by means of deformable conductive components disposed in accordance with surface mounted component technology.

REFERENCES:
patent: 6087680 (2000-07-01), Gramann et al.
patent: 6936855 (2005-08-01), Harrah
patent: 2002/0068389 (2002-06-01), Green
patent: 2004/0149998 (2004-08-01), Henson et al.
patent: 2005/0265029 (2005-12-01), Epstein et al.
patent: 3404644 (1985-08-01), None
patent: 4-208588 (1992-07-01), None
ESP@CENET Database Abstract of JP 4208588.
Patent Abstracts of Japan for JP 04208588.
English Abstract for DE 3404644.
Search Report corresponding to FR 0412390, Filed Nov. 22, 2004.

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