Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Patent
1997-06-03
1999-09-21
Fourson, George R.
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
438975, 438 48, 296031, H01L 213065, H01L 2166
Patent
active
059565640
ABSTRACT:
An apparatus in accordance with this invention includes an alignment mark that is formed in a substrate. The alignment mark extends across a dice line so that, upon dicing the substrate, the mark is exposed in the substrate's side edge. The mark is formed at a predetermined distance from a position at which a feature is desired to be formed on the substrate's side edge using a mask. Accordingly, the mark is a positional reference that can be used for highly accurate placement of the feature on the side surface of the substrate with the mask. Preferably, the mark is formed of metal or other material enhanced to a size that is readily detectable by an alignment system with which the mark is to be used. The invention also includes methods for making the alignment mark.
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Kappel Norbert
Newman Thomas H
Fourson George R.
Jones Allston L.
Ultratech Stepper, Inc.
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