Method of making a semiconductor wafer with alignment marks

Details Method of making a semiconductor wafer with alignment marks Method of making a semiconductor wafer with alignment marks

1995-06-01

1998-07-28

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

438975, 148 332, H01L 2144

Patent

active

057862672

ABSTRACT:
Disclosed is an alignment mark for the X directional alignment of a chip area on a semiconductor wafer, for example. The alignment mark comprises recesses and projections formed on a semiconductor substrate. The recesses or projections are repeatedly arranged in the X direction. The X directional width of the recesses or projections is set smaller than the X directional width of a grain on a metal film formed on the recesses and projections or the average particle size, as viewed from above the semiconductor substrate. The projections may be formed by an insulating layer formed on the semiconductor substrate.

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Harry Stover and Brian J. Thompson, Selected Papers on Optical Microlithography, SPIE Milestone Series, vol. MS 55, Jan. 1, 1992.

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