Method of making a semiconductor wafer

Details Method of making a semiconductor wafer Method of making a semiconductor wafer

1975-12-11

1978-12-05

Whitehead, Harold D.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51 59SS, 51290, B24B 100

Patent

active

041279697

ABSTRACT:
Semiconductor wafers with apertures, that may include crystal orientation surfaces, are made by boring semiconductor ingots and slicing the bored ingots perpendicular to the bore or at an angle thereto. Novel means are provided for handling the wafers without scratching the major surfaces thereof, for supporting the slices to clean them, and for supporting the slices to coat the major surfaces.

REFERENCES:
patent: 3078549 (1963-02-01), Wende
patent: 3094026 (1963-06-01), Pottle
patent: 3124868 (1964-03-01), Zacaroli
patent: 3237281 (1966-03-01), Antonson
patent: 3699719 (1972-10-01), Rozdilsky

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