Method of making a semiconductor package with integrated...

Details Method of making a semiconductor package with integrated... Method of making a semiconductor package with integrated...

2006-08-29

2006-08-29

Owens, Douglas W. (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000

Reexamination Certificate

active

07098080

ABSTRACT:
A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

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