Method of making a semiconductor heat sink

Details Method of making a semiconductor heat sink Method of making a semiconductor heat sink

1990-05-30

1992-02-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437249, 437902, H01L 21461

Patent

active

050894439

ABSTRACT:
A method for making a heat sink device as constructed for use with a semiconductor circuit chip 15. On a thermally conductive substrate a layer of a metal alloy is deposited. The metal alloy is thermally conductive and electrically insulative. Cavities are selectively and controllably formed in the alloy layer to define a plurality of heat dissipation members having heat dissipation surfaces.

REFERENCES:
patent: 4080722 (1978-03-01), Klatskin et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4783428 (1988-11-01), Kalfus
patent: 4860444 (1989-08-01), Herell et al.

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