Method of making a semiconductor device with adhesive...

Details Method of making a semiconductor device with adhesive... Method of making a semiconductor device with adhesive...

2005-03-22

2005-03-22

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S108000, C438S127000, C438S612000, C438S613000

Reexamination Certificate

active

06869822

ABSTRACT:
According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

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Patent Abstracts of Japan, vol. 2000, no. 18, JP 2001 024029 A (NEC CORP), Jan. 26, 2001 * abstract *.

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