Radiant energy – Infrared-to-visible imaging
Patent
1993-03-30
1995-03-07
Fields, Carolyn E.
Radiant energy
Infrared-to-visible imaging
250332, 2503581, 374 5, 437 8, G01N 2572
Patent
active
053960688
ABSTRACT:
The inventive methods of making a semiconductor device, e.g., a laser, comprise thermal (e.g., 3-5 .mu.m wavelength) imaging of a powered, partially completed device. The thermal image is obtained with apparatus that is capable of forming a substantially diffraction-limited image on a sensor array with an acquisition time of no more than 0.1 seconds, preferable no more than 0.01 seconds. In preferred embodiments, the image has temperature resolution of 0.01.degree. C. or better. Exemplary apparatus is disclosed. The inventive method facilitates, for instance, early identification of devices that are likely to fail lifetime requirements.
REFERENCES:
patent: 4466746 (1984-08-01), Hancock et al.
patent: 5294198 (1994-03-01), Schlagheck
patent: 5302830 (1994-04-01), Shivanandan
Woolaway, "New Sensor Technology for the 3-5 .mu.m Imaging Band", Photonics Spectra, Feb. 1991, pp. 113-119.
Masi, "What can Thermal Imaging Do For You", Test & Measurement World, May 1988.
Weight, "Thermography Testing of Production PC Boards", Electronic Packaging & Production, Oct. 1981, pp. 69-74.
"Imager Finds Microelectronic Hot Spots", by R. J. Stetson et al., Laser Focus World, Jun. 1990.
"Thermal Resistance of Heterostructure Lasers", by W. B. Joyce et al., Journal of Applied Physics, vol. 46, No. 2, Feb. 1975, pp. 855-862.
AT&T Corp.
Fields Carolyn E.
Pacher Eugen E.
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