Method of making a semiconductor device having lead pins and a m

Details Method of making a semiconductor device having lead pins and a m Method of making a semiconductor device having lead pins and a m

1991-01-29

1992-03-03

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437915, 437245, 174 524, H01L 2152, H01L 2158, H01L 2160

Patent

active

050932829

ABSTRACT:
Disclosed is a method for making a semiconductor device in which the Pin Grid Array (PGA) is improved so that a plurality of lead pins project from the undersurface of a metal base of a package substrate as input and output terminals of a Large Scale Integrated-circuit (LSI). The method comprises mounting a semiconductor chip on a heat sink to the base, superposing a printed circuit board on the base and connecting electrical lead pins to the outer ends of wiring patterns which are formed radially and downwardly projecting through the base, and assembling a metal shell to the upper surface of the base and covering the chip, bonding wires and wiring patterns, wherein the patterns are formed such that the outer ends of the patterns are located within the vicinity over the outermost rows and columns of through holes for connecting lead pins. Furthermore, in the method of producing the device, a central portion patterning wiring layer, which is electrically short-circuited for gold plating, is provided in order to stabilize the connection with the bonding wires, and this center layer is cut off after the short circuit is performed.

REFERENCES:
patent: 4307934 (1981-12-01), Palmer
patent: 4514752 (1985-04-01), Engel et al.
patent: 4630096 (1986-12-01), Drye et al.
IBM Technical Disclosure Bulletin, vol. 30, No. 6, Nov. 1987, "High Performance Multi-Chip Module", p. 437.

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