Method of making a semiconductor device having improved contacts

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438620, 438637, 438631, H01L 218242

Patent

active

058277706

ABSTRACT:
A semiconductor device and fabrication process wherein the device includes a conductive layer with a localized thick region positioned below the contact hole. In one embodiment of the invention, the thick region to which contact is made is formed by means of an opening in an underlayer of material. This embodiment of the device includes an underlayer of material having an opening therein; a layer of thin conductive material formed on the underlayer and in the opening; an overlayer of material having a contact hole therethrough formed on the layer of thin conductive material; a conductor contacting the layer of thin conductive material through the contact hole; and wherein the opening in the underlayer is positioned below the contact hole and sized and shaped to form a localized thick region in the layer of thin conductive material within the opening.

REFERENCES:
patent: 4754318 (1988-06-01), Momose et al.
patent: 4857481 (1989-08-01), Tam et al.
patent: 4866009 (1989-09-01), Matsuda
patent: 4994410 (1991-02-01), Sun et al.
patent: 5028990 (1991-07-01), Kotaki et al.
patent: 5094981 (1992-03-01), Chung et al.
patent: 5200359 (1993-04-01), Pearey et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5229307 (1993-07-01), Vora et al.
patent: 5243219 (1993-09-01), Katayama
patent: 5247197 (1993-09-01), Ema
patent: 5296407 (1994-03-01), Eguchi
patent: 5317193 (1994-05-01), Watanabe
patent: 5321648 (1994-06-01), Dennison
patent: 5399890 (1995-03-01), Okada et al.
patent: 5440167 (1995-08-01), Iranmanesh

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a semiconductor device having improved contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a semiconductor device having improved contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a semiconductor device having improved contacts will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1613484

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.