Method of making a semiconductor device assembly

Details Method of making a semiconductor device assembly Method of making a semiconductor device assembly

1987-10-15

1989-04-11

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437221, 361386, 357 80, 174 525, 29739, H01L 2312

Patent

active

048206598

ABSTRACT:
The invention is a semiconductor device assembly and method of making the same. A mounting plate has positioning means for positioning the plate relative to a header, a first mounting surface of the plate is attached to the header and a semiconductor device is attached to a second mounting surface of the mounting plate. The assembly is made by forming the mounting plate, positioning the mounting plate relative to the header by the positioning means, attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. Another method of making the assembly is by defining and etching a mounting plate and attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. This assembly and process provides an efficient means for mounting semiconductor devices and in particular electro-optic devices such as lasers.

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patent: 4394679 (1983-07-01), Hawrylo
patent: 4584688 (1986-04-01), Demeure et al.

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