Method of making a semiconductor device

Details Method of making a semiconductor device Method of making a semiconductor device

1993-03-18

1995-03-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437194, 437228, H01L 2144

Patent

active

053977432

ABSTRACT:
A method of making a semiconductor device capable of simplifying the overall manufacturing processes and carrying out the reliable interconnections between wires. The method includes forming a first insulator over a semiconductor substrate, forming a first conductor over the first insulator and then patterning the first conductor to form a plurality of first wires, forming a second insulator over the entire exposed surface and then removing a portion of the second insulator disposed over the surface of a selector first wire to form a contact hole, forming a second conductor over the entire exposed surface and then patterning the second conductor to form an interconnection wire over the contact hole, forming a third insulator having uniform thickness and a fourth insulator having the smoothing surface in this order, etching back the third insulator and the fourth insulator, until the surface of the interconnection wire is exposed, and forming a third conductor having an uniform thickness over the entire exposed surface and the then patterning the third conductor to form a second wire to be connected to the selected first wire through the interconnection wire.

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