Method of making a semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 35, 437 24, 437DIG959, 148DIG84, H01L 2144

Patent

active

056839375

ABSTRACT:
A semiconductor device includes a rectangular semiconductor chip having a main surface, a stripe-form semiconductor element forming portion formed in parallel to one of sides of the semiconductor chip to cross the main surface, a first groove portion formed along one of sides of the semiconductor element forming portion in a longitudinal direction, a second groove portion formed along the other side of the semiconductor element forming portion in the longitudinal direction, the second groove portion including a hollow space which is enlarged in substantially a central portion, a surface electrode formed on at least part of an upper portion of the semiconductor element forming portion, an external lead connecting terminal electrode formed in the hollow space, a wiring formed on part of a bottom surface and a side surface, which is adjacent to stripe-form portion, of the second groove portion, for electrically connecting the surface electrode with the terminal electrode, a first dummy electrode formed at least on the main surface of the semiconductor chip to face the semiconductor element forming portion with the first groove portion disposed therebetween, and a second dummy electrode formed on the main surface of the semiconductor chip to face the semiconductor element forming portion with the second groove portion disposed therebetween.

REFERENCES:
patent: H170 (1986-12-01), Binari
patent: 4448797 (1984-05-01), Burnham
patent: 4525919 (1985-07-01), Fabian
patent: 4599790 (1986-07-01), Kim et al.
patent: 4785455 (1988-11-01), Sawai et al.
patent: 4904608 (1990-02-01), Gentner et al.
patent: 4997779 (1991-03-01), Kohno
patent: 5027364 (1991-06-01), Thulke
patent: 5073520 (1991-12-01), Yoshida
G. Du et al., Ohmic Heating and Series Resistance of a Vertical-Microcavity Surface-emitting Laser, Jul. 15, 1991, 265-267, Applied Physics Letters, vol. 59, No. 3, New York.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1832768

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.