Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2006-12-12

2006-12-12

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S785000, C257SE23078

Reexamination Certificate

active

07148082

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an opening in a ground plane, thereby electrically connecting the ground plane and the pad.

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U.S. Appl. No. 10/714,794, filed Nov. 17, 2003, entitled “Semiconductor Chip Assembly with Embedded Metal Pillar”.

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