Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2006-08-08
2006-08-08
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
Reexamination Certificate
active
07087466
ABSTRACT:
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, electrically connecting a conductive trace that includes a pillar and a routing line to the pad, then inserting the pillar into an opening in a ground plane, and then forming a solder joint that electrically connects the pillar and the ground plane, wherein the ground plane is electrically connected to the pad.
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U.S. Appl. No. 10/714,794, filed Nov. 17, 2003, entitled “Semiconductor Chip Assembly with Embedded Metal Pillar”.
Bridge Semiconductor Corporation
Coleman W. David
Sigmond David M.
Stark Jarrett
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