Method of making a resin encapsulated pin grid array with integr

Details Method of making a resin encapsulated pin grid array with integr Method of making a resin encapsulated pin grid array with integr

1991-02-06

1992-04-28

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437902, 264261, 26427214, 26427215, 26427217, 264277, 264DIG76, 249 95, 249 96, 249 97, H01L 2156, H01L 2158

Patent

active

051089556

ABSTRACT:
A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

REFERENCES:
patent: 4266239 (1981-05-01), Miyagaki
patent: 4541005 (1985-10-01), Hunter
patent: 4778641 (1988-10-01), Chia
patent: 4822550 (1989-04-01), Komathu et al.
patent: 4823234 (1989-04-01), Konishi
patent: 4868638 (1989-09-01), Hirata et al.
patent: 4890152 (1989-12-01), Hirata et al.

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