Method of making a resin encapsulated pin grid array with integr

Details Method of making a resin encapsulated pin grid array with integr Method of making a resin encapsulated pin grid array with integr

1991-05-15

1993-01-12

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437215, 437902, H01L 21449

Patent

active

051790394

ABSTRACT:
A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

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