Method of making a relatively flat semiconductor package having

Details Method of making a relatively flat semiconductor package having Method of making a relatively flat semiconductor package having

1992-07-01

1994-01-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437217, 437220, H01L 2160

Patent

active

052759750

ABSTRACT:
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

REFERENCES:
patent: 3793720 (1974-02-01), Van Rijsewijk et al.
patent: 4480148 (1984-10-01), Archer
patent: 4672421 (1987-06-01), Lin
patent: 4725692 (1988-02-01), Ishii et al.
patent: 4740868 (1988-04-01), Hawkins
patent: 4837184 (1989-06-01), Lin et al.

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