Plastic and nonmetallic article shaping or treating: processes – Applying tensile stress to workpiece during heat curing
Patent
1996-03-29
1999-03-09
Dixon, Merrick
Plastic and nonmetallic article shaping or treating: processes
Applying tensile stress to workpiece during heat curing
264234, 264319, 264345, 264348, 264237, B29C 6100
Patent
active
058796070
ABSTRACT:
A protective, impact resistant material and method which includes a fabric of thermoplastic polymeric fibers having a strength of at least 0.5 GPa and an elastic modulus of at least 25 GPa and a matrix of polymeric material disposed in the interstices between the fibers having an elastic modulus of 0.2 to 3.times.10.sup.6 psi. The polymeric fibers can be gel spun, polyethylene, polypropylene, nylon, polyvinyl alcohol and polyethylene terephthalate. In a second embodiment, the matrix is derived from the fabric. The method includes the steps of providing a matrix of melted polymeric material transparent to energy of a predetermined type and having a predetermined melting temperature, placing a fabric of polymeric fibers having a melting temperature higher than that of the matrix in the matrix, applying a pressure of 1000 to 2000 psi to the fabric in the matrix, then raising the temperature to the melting temperature of the fabric for the time required to cause consolidation of the fabric and the matrix and rapidly cooling the consolidated fabric and matrix to a temperature below the melting temperature of the fabric. In accordance with the second embodiment there is provided a fabric of polymeric fibers as in the first embodiment which is operated upon as in the first embodiment to cause melting of a sufficient portion of the fabric to fill the interstices between the fibers of the fabric. The fabric is then rapidly cooled to a temperature below the melting temperature of the fabric.
REFERENCES:
patent: 3309861 (1967-03-01), Pierson et al.
patent: 4034138 (1977-07-01), Babayan
Farris Richard J.
Klocek Paul
Lietzau Christian
MacKnight William J.
Dixon Merrick
Lenzen, Jr. Glenn H.
Raytheon TI Systems & University of Massachusetts
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