Semiconductor device manufacturing: process – With measuring or testing
Patent
1998-12-22
2000-11-21
Guay, John
Semiconductor device manufacturing: process
With measuring or testing
438 15, 438 17, 438 18, 438117, 438617, H01L 2166
Patent
active
061501867
ABSTRACT:
Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25.degree. C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating a shape and heat treating provides a shaped deposit with improved material properties. Coating a shape with a portion connected to a base and a portion detached therefrom can provide a resilient, conductive contact useful for electronic applications.
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Chen Jimmy Kuo-Wei
Dozier Thomas H.
Eldridge Benjamin N.
Herman Gayle J.
Yeh Junjye J.
Chambliss Alonzo
FormFactor Inc.
Guay John
Larwood David
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