Method of making a printing wiring board

Details Method of making a printing wiring board Method of making a printing wiring board

1994-09-01

1996-04-02

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29847, 427 97, H05K 342, H05K 344

Patent

active

055028934

ABSTRACT:
A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and high humidity since both the metal core and the organic non-conductive layer are firmly adhered. An organic non-conductive layer is formed over the metal core (e.g., of aluminum) with a metal plated layer (e.g., nickel) therebetween for protecting the metal core. A metal oxide layer is also used for enhancing adhesive force. By utilizing such a metal oxide layer, it is possible to more effectively prevent the organic non-conductive layer from separating from the plated layer (and thus the metal core). Further, the protecting metal plated layer can protect the metal core from erosion caused by contact with a strong alkali solution, etc. as may be used in a process of forming the metal oxide layer. Still further, copper plating inside the through hole can be performed easily.

REFERENCES:
patent: 3334395 (1967-03-01), Cook et al.
patent: 3673680 (1972-07-01), Tanaka et al.
patent: 3855692 (1974-12-01), Dugan
patent: 3934335 (1976-01-01), Nelson
patent: 4015987 (1977-04-01), Garry
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5160579 (1992-11-01), Larson
"Plating Through-Holes" IBM Technical Disclosure Bulletin, vol. 9, No. 10, Mar. 1967, pp. 1255-1256.

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