Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
Patent
1975-05-28
1976-11-09
Kucia, Richard R.
Plastic and nonmetallic article shaping or treating: processes
Carbonizing to form article
Agglomeration or accretion
264 48, 264321, 264327, B29D 2700
Patent
active
039911454
ABSTRACT:
A thermoplastic plate, for example, one of polypropylene or nylon, fabricated so it has an open-cell structure, has a radiation transparent cover sheet applied to one face thereof. The cover sheet has an energy absorbing coating (e.g. of carbon and nitrocellulose) in intimate contact with the plate. A modulated laser beam is then transmitted through said cover sheet to selectively transfer some of the energy absorbing material to the plate according to the configuration required to define the areas of relief desired in the plate. The cover sheet is then removed except for the portion of the energy absorbing coating transferred to the plate. The entire surface of the plate is then exposed to infra-red rays. The portions of said surface to which energy absorbing material was transferred are elevated in temperature, by the absorbed infra-red energy, to the point that the structure beneath the transferred material collapses, thus causing those portions to sink to a plane below the plane of the other portions of the plate. An additional infra-red heating step is then performed to produce further collapse of said portions of the surface while passing a cooling fluid through that portion of the plate which still has open, interconnected cells. The cooling fluid prevents collapse of those cells which did not initially partially collapse, and the concurrent infra-red heating step further collapses the cells which initially collapsed enough to block passage of the cooling fluid therethrough.
REFERENCES:
patent: 2986777 (1961-06-01), Carter
patent: 3739088 (1973-06-01), Landsman
patent: 3742853 (1973-07-01), Landsman
patent: 3836624 (1974-09-01), Ferris
patent: 3890414 (1975-06-01), Ricciardi
Hall William D.
Kucia Richard R.
Log Etronics Inc.
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