Metal fusion bonding – Process – Plural joints
Patent
1994-12-21
1996-07-09
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228135, 2282481, 29843, 29845, H05K 334
Patent
active
055336655
ABSTRACT:
An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.
REFERENCES:
patent: 3254323 (1963-05-01), Wyse
patent: 3790866 (1974-02-01), Meyer et al.
patent: 3866998 (1975-02-01), Iantorno
patent: 4110904 (1978-09-01), Johnson
patent: 4257667 (1981-03-01), Iantorno
patent: 4404172 (1985-01-01), Leary et al.
patent: 4631639 (1986-12-01), Biraud
patent: 5129573 (1992-07-01), Duffey
patent: 5257165 (1993-10-01), Chiang
Sinclair William Y.
Walter James P.
Aries Electronics, Inc.
Casella Anthony J.
Heinrich Samuel M.
Hespos Gerald E.
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