Method of making a printed circuit board or card

Details Method of making a printed circuit board or card Method of making a printed circuit board or card

1994-09-21

1996-01-02

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29840, 29843, 174263, 2281801, 427 97, 428901, H05K 342, H05K 334, H05K 346

Patent

active

054797039

ABSTRACT:
A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of electrically insulating material attached on both sides thereof. The circuitized power cores also include a plurality of plated through holes formed therethrough in substantially the same pattern on each circuitized power core. The circuitized power cores are parallel to each other such that corresponding plated through holes in the two circuitized power cores are co-linear. A plurality of substantially spherical balls are located between the circuitized power cores and are in contact with the corresponding plated through holes on facing cards. The balls have a diameter slightly larger than the opening of the plated through holes and are made of an electrically conductive material.

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IBM Technical Disclosure Bulletin, vol. 37, No. 2B, Feb. 1994, pp. 337-338.

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