Method of making a printed circuit board having mutually etchabl

Details Method of making a printed circuit board having mutually etchabl Method of making a printed circuit board having mutually etchabl

1977-12-22

1980-02-26

Goolkasian, John T.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29625, 156628, 156666, 156630, 156902, 174 685, 204 27, 204 49, 428626, 428901, 428639, C25D 100

Patent

active

041904745

ABSTRACT:
A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.

REFERENCES:
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patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3183067 (1965-05-01), Du Rose et al.
patent: 3454376 (1969-07-01), Luce et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3591350 (1971-07-01), Stareck et al.
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4061837 (1977-12-01), Hutkin

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