Method of making a printed circuit board having filled holes and

Details Method of making a printed circuit board having filled holes and Method of making a printed circuit board having filled holes and

1998-05-12

2000-06-27

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 174262, 174265, 427 97, H01K 310, H01R 909

Patent

active

060791004

ABSTRACT:
A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer of support material atop the dielectric layer and over the hole(s), positioning a quantity of fill material on the thin layer of support material (preferably before positioning the thin layer on the dielectric) and thereafter applying a predetermined force sufficient to cause the thin support layer to rupture or otherwise deform (including melting from heat application thereto) such that the fill material is forcibly driven into the accommodating hole(s). Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.

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