Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-07-15
2000-01-04
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29846, H05K 342
Patent
active
060096209
ABSTRACT:
A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
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IBM Technical Disclosure Bulletin, vol. 11, No. 7, Dec. 1968, "Face Protection Of Printed Circuit Boards", by McDermott.
Bhatt Ashwinkumar C.
Kotylo Joseph A.
Lyjak Kenneth S.
Rai Amarjit S.
Welsh John A.
Fraley Lawrence R.
International Business Machines - Corporation
Rushing, Jr. Bobby
Young Lee
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