Method of making a printed circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S830000, C029S846000

Reexamination Certificate

active

07152315

ABSTRACT:
A method10, 80, 81for making multi-layer electronic circuit boards77, 137, 139having metallized apertures18, 20, 34, 40, 104, 106, 120.

REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4404059 (1983-09-01), Livshits et al.
patent: 4683653 (1987-08-01), Iwasa
patent: 5224265 (1993-07-01), Dux et al.
patent: 5227338 (1993-07-01), Kryzaniwsky
patent: 5232548 (1993-08-01), Ehrenberg et al.
patent: 5738797 (1998-04-01), Belke, Jr. et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5768108 (1998-06-01), Miura et al.
patent: 5786986 (1998-07-01), Bregman et al.
patent: 5876842 (1999-03-01), Duffy et al.
patent: 6098282 (2000-08-01), Frankeny et al.
patent: 6248959 (2001-06-01), Sylvester
patent: 6356002 (2002-03-01), Witherspoon et al.
patent: 6449839 (2002-09-01), Glovatsky et al.
patent: 6492201 (2002-12-01), Haba
patent: 6499214 (2002-12-01), Li et al.
patent: 6998540 (2006-02-01), Belke et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3699008

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.