Method of making a printed circuit board

Details Method of making a printed circuit board Method of making a printed circuit board

1985-12-30

1992-03-10

Lechert, Jr., Stephen J.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 10, 419 66, 427 96, 427 97, 428901, G22F 700

Patent

active

050948113

ABSTRACT:
The invention is a method for making an electrically conductive path on the wall of a passage through a substrate. It is especially useful for connecting electrically conductive paths (25) on opposite sides of a circuit board (20). The method is characterized by the steps of forming a tapered passage (21) through the substrate (20) that connects to at least one conductive path on each side of the substrate (20), filling the tapered passage (21) with an electrically conductive powder (10), applying pressure with a tapered die (30) to compact the powder (11) against the wall of the passage (21) without blocking the passage, and then heating the compacted powder (11) to a temperature that increases the conductivity and ductility of the compacted powder (11) and its adhesion to the substrate (20) without adversely affecting the shape or condition of the substrate (20).

REFERENCES:
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patent: 4263341 (1981-04-01), Martyniak
patent: 4290195 (1981-09-01), Rippere
patent: 4327124 (1982-04-01), DesMarais
patent: 4378383 (1983-03-01), Moritz

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