Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1999-10-20
2000-10-31
Talbot, Brian K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427282, 4273831, 4273855, 101129, B05D 512
Patent
active
061399043
ABSTRACT:
A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plurality of blind via conductors having depressions closed by resin fillings. The method comprises the steps of preparing the base provided with the through via conductors having the through holes and the blind via conductors having the depressions, filling the through holes of the through via conductors and the depressions of the blind via conductors with resin paste by printing, while at the same time forming, on an upper surface of the base and at locations around the through holes of the through via conductors and the depressions of the blind via conductors, a plurality of projections made of the above described resin paste by printing, and curing the resin paste, thereby forming the resin fillings in the through holes of the through via conductors and the depressions of the blind via conductors. By this method, the upper surfaces of the resin fillings in the through holes and the depressions are not caused to recede or sink and become lower in level than the upper surface of the base but can be maintained higher in level than the upper surface of the base, thus making it possible to dispense with a manufacturing step for closing receding spaces and manufacture the printed board at lower cost.
REFERENCES:
patent: 4323593 (1982-04-01), Tsunashima
patent: 4964948 (1990-10-01), Reed
patent: 5191709 (1993-03-01), Kawakami et al.
patent: 5268194 (1993-12-01), Kawakami et al.
patent: 5822856 (1998-10-01), Bhatt et al.
Hasegawa Katsuhiko
Hirano Satoshi
Hisada Osamu
Kameyama Yutaro
Kito Naoki
NGK Spark Plug Co. Ltd.
Talbot Brian K.
LandOfFree
Method of making a printed board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a printed board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a printed board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2048347