Method of making a post molded cavity package with internal dam

Details Method of making a post molded cavity package with internal dam Method of making a post molded cavity package with internal dam

1990-04-20

1992-04-21

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437215, 437217, 437219, H01L 2152, H01L 2156, H01L 2158, H01L 2160

Patent

active

051067846

ABSTRACT:
A method of producing a cavity package around an assembled semiconductor device is disclosed. The method includes providing a chip attach pad having a plurality of chip attach pad straps, each strap extending outwardly from the outer edge of the chip attach pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the chip attach pad; molding a package material onto a central portion of lead fingers and the chip attach pad straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a chip attach pad with the integrated circuit thereon within the cavity with the chip attach straps. Heat sinks can also be used to promote high levels of thermal dissipation.

REFERENCES:
patent: 3714370 (1973-01-01), Nixon et al.
patent: 4025716 (1977-05-01), Morse
patent: 4209355 (1980-06-01), Burns
patent: 4234666 (1980-11-01), Gursky
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4303934 (1981-12-01), Stitt
patent: 4607276 (1986-08-01), Butt

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