Method of making a positioned chip surface covering

Details Method of making a positioned chip surface covering Method of making a positioned chip surface covering

1984-10-30

1988-08-02

Gallagher, John J.

Coating processes

Solid particles or fibers applied

Localized different areas produced

156 63, 156276, 156279, 156315, 427201, 427202, 428143, 428207, 428323, B05D 500

Patent

active

047613068

ABSTRACT:
The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditons are adjusted so that the first adhesive material demonstrates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips.

REFERENCES:
patent: 4292394 (1981-09-01), Chu et al.

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