Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1980-09-26
1983-06-14
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156253, 156267, 1563066, 174 685, 428901, B32B 3100
Patent
active
043881360
ABSTRACT:
A method of fabricating a "hybrid" multilayer printed circuit board combining two dissimilar plastic layers of polyimide resin/glass and of epoxy resin/glass laminates. The finished hybrid multilayer printed circuit board is for, e.g., the support of and electrical interconnection to a plurality of magnetizable memory cores. The method includes sandwiching a plurality of epoxy-glass printed circuit boards having the desired copper patterns on both sides between two polyimide-glass printed circuit boards, each having the desired copper pattern on only one side. All the printed circuit boards are laminated with epoxy-glass prepreg to form a single hybrid multilayer printed circuit board consisting of the sandwiched epoxy-glass printed circuit boards and the sandwiching polyimide-glass printed circuit boards. Interconnections between patterned layers are formed by copper-plate throughholes.
REFERENCES:
patent: 3626586 (1971-12-01), Huie et al.
patent: 3739469 (1973-06-01), Dougherty
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 4030190 (1977-06-01), Varker
IBM Technical Disclosure Bulletin, "Use of Polyimide to Obtain a Smooth Surface", 1978, p. 3020.
Huie Jaken Y.
Jacobus Dan
Grace Kenneth T.
Sperry Corporation
Truex Marshall M.
Weston Caleb
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