Method of making a plastic-packaged semiconductor device having

Details Method of making a plastic-packaged semiconductor device having Method of making a plastic-packaged semiconductor device having

1991-06-27

1992-04-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437207, 437214, 437220, H01L 2156, H01L 2158, H01L 2160

Patent

active

051048272

ABSTRACT:
A method of making a plastic-packaged semiconductor device, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed cirucit boards for aiding in alignment of the device with the board.

REFERENCES:
patent: 3716764 (1973-02-01), Birchler et al.
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4794446 (1988-12-01), Hamano
patent: 4870476 (1989-09-01), Solstad
Microelectronics Packaging Handbook, 1988, pp. 578-591.

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