Method of making a packaged IC chip

Details Method of making a packaged IC chip Method of making a packaged IC chip

1988-05-23

1989-04-11

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29827, 174 506, 174 525, 264152, 206330, 357 68, 357 70, 437206, H01L 2166

Patent

active

048206580

ABSTRACT:
A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.

REFERENCES:
patent: 4653174 (1987-03-01), Gilder Jr. et al.
patent: 4663650 (1987-05-01), Gilder et al.
patent: 4663651 (1987-05-01), Gilder et al.

Affiliated with

Also associated with

Rating

Method of making a packaged IC chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a packaged IC chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a packaged IC chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-667088