Method of making a multipad solder preform

Details Method of making a multipad solder preform Method of making a multipad solder preform

1987-10-09

1988-10-04

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

228 563, 228246, H05K 334

Patent

active

047747609

ABSTRACT:
A solder preform and technique for making same is disclosed for use in a one time flux process for attaching electronic modules to printed circuit substrates via plated through holes or surface mount pads.

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patent: 4557411 (1985-12-01), Farquharson et al.
Surface Mount Technology, International Society for Hybrid Microelectronics, pp. 205-218, pp. 221-226.
Printed Board Dimensions and Tolerances, ANSI/IPC-D-300G, A Standard Developed by the Specification Subcommittee of the Rigid Single and Double Sided Printed Board Committee of the Institute for Interconnecting and Packaging Electronic Circuits, The Institute for Interconnecting and Packaging Electronic Circuits pp. 496-506.
IBM Technical Disclosure Bulletin, vol. 13, No. 8, 1/71, pp. 23-30, "Etched Braze Preform Sheet" to Koop et al.

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