Method of making a multilayer LTCC tub architecture for hermetic

Details Method of making a multilayer LTCC tub architecture for hermetic Method of making a multilayer LTCC tub architecture for hermetic

1995-02-22

1997-03-18

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156252, 156268, 264 61, 174 524, B32B 3118, B32B 3126

Patent

active

056118767

ABSTRACT:
A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.

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