Method of making a multilayer hybrid circuit

Details Method of making a multilayer hybrid circuit Method of making a multilayer hybrid circuit

1993-01-27

1995-07-04

Hall, Carl E.

Metal working

Electric condenser making

Solid dielectric type

296021, 29620, 264 61, 361738, H01G 430

Patent

active

054288851

ABSTRACT:
A multilayer hybrid circuit, which looks like a conventional printed circuit board, has a laminated body having at least one of a plurality of dielectric layers, magnetic layers, and conductive patterns, composing a capacitor, an inductor, and a resistor, and mounts a semiconductor chip. An external connection is effected by side terminals positioned on side walls of the laminated body. In one embodiment, said laminated body and said semiconductor chip are molded together by plastics so that the result looks as if a conventional semiconductor chip. In another embodiment, a resilient relay board is coupled with the laminated body when mounted on a mother board so that stress on the mother board is not applied directly to the laminated body.

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