Method of making a multilayer electronic component with inter-la

Details Method of making a multilayer electronic component with inter-la Method of making a multilayer electronic component with inter-la

1995-11-22

1997-07-22

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 1566281, 216 17, 216 18, 216 39, B05D 304, B05D 512

Patent

active

056501994

ABSTRACT:
A multilayered electronic component created by a wet process, wherein a ceramic base is imprinted with an electrode and an interlayer via is formed on top of it by introducing a via pattern printed in ink that is incompatible with a layer of wet ceramic slurry coating placed on top of the electrode and the via pattern. The incompatibility leads to a physical-chemical reaction that removes ceramic material away from the top of the via pattern by diffusing ceramic materials contained in a colloidal suspension forming a via-through hole. After the wet ceramic slurry is dried, it surrounds the via-through hole and the imprinted via pattern. Then a new electrode layer is imprinted on top of the dried ceramic coating. The new electrode layer completes an electrically conductive path formed from the bottom-most electrode layer, to the via pattern, and then terminating at the new electrode layer on top.

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patent: 5032815 (1991-07-01), Kobayashi et al.
patent: 5206620 (1993-04-01), Watamabe et al.
Miles Trainer Engineering Report, vol. I, Xerox Electro-Optical Systems, Apr. 22, 1981.

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