Method of making a multilayer ceramic substrate having reduced s

Details Method of making a multilayer ceramic substrate having reduced s Method of making a multilayer ceramic substrate having reduced s

1996-11-05

1998-05-26

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156252, 264619, 29851, B32B 3112, B32B 3126

Patent

active

057559031

ABSTRACT:
A multilayer ceramic substrate for microelectronics includes stress relief pads to reduce stress in the vicinity of functional vias penetrating through multiple ceramic layers. The stress relief pads are located only on the major surface of a ceramic layer and accordingly do not prevent wiring from being placed directly below the stress relief pads on the bottom surface of the same layer or the top surface of the immediately underlying layer. The invention also includes the method of making the multilayer ceramic substrate with stress relief pads.

REFERENCES:
patent: 3953562 (1976-04-01), Hait et al.
patent: 4237606 (1980-12-01), Niwa et al.
patent: 4880684 (1989-11-01), Boss et al.
patent: 5029242 (1991-07-01), Sammet
patent: 5093186 (1992-03-01), Kimura et al.
patent: 5130498 (1992-07-01), Yoshida et al.
patent: 5293503 (1994-03-01), Nishigoori
patent: 5451720 (1995-09-01), Estes et al.
patent: 5453913 (1995-09-01), Koyanagi
IBM Technical Disclosure Bulletin, vol.. 20, No. 4, Sep. 1977 "Dummy Pads for Increased Creep Resistance".
IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, "Via Design Minimize Stress Levels in Multilayer Ceramic Substrates".

Affiliated with

Also associated with

Rating

Method of making a multilayer ceramic substrate having reduced s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a multilayer ceramic substrate having reduced s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a multilayer ceramic substrate having reduced s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1956117