Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-05-22
1998-07-14
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29874, 427 97, H01K 310, H05K 310
Patent
active
057785295
ABSTRACT:
A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support base exposing the underside of the thin film structure, thereby allowing high density connectors to be mounted on both surfaces of the thin film structure, greatly enhancing the ability to communicate signals between adjacent substrates in the chip module. This avoids the need to route the signals either through the rigid support base or to the edges of the thin film structure. Power and ground, which do not require a high connection density, are routed in low impedance paths through the support base. Preferably, the thin film structure is made of alternating layers of patterned metal, such as copper, and a low dielectric organic polymer, such as a polyimide.
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Beilin Solomon I.
Chou William T.
Kudzuma David
Lee Michael G.
Murase Teruo
Echols P. W.
Fujitsu Limited
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