Method of making a multichip module comprising at least one thin

Details Method of making a multichip module comprising at least one thin Method of making a multichip module comprising at least one thin

1994-12-28

1997-05-20

Echols, P. W.

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

29846, 29852, H05K 302, H01K 310

Patent

active

056309473

ABSTRACT:
The present invention relates to the preparation of a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.

REFERENCES:
patent: 4720324 (1988-01-01), Hayward
patent: 4970106 (1990-11-01), DiStefano et al.
patent: 5091769 (1992-02-01), Eichelberger
patent: 5109601 (1992-05-01), McBride

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