Method of making a multi-layer ceramic substrate

Details Method of making a multi-layer ceramic substrate Method of making a multi-layer ceramic substrate

1976-12-10

1981-09-15

Parrish, John

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 63, 264 86, 264133, 264135, 264332, C04B 3908

Patent

active

042897190

ABSTRACT:
A method of making a multi-layer ceramic substrate for an integrated circuit device package having internal circuitry by forming a plurality of porous ceramic bisque sheets, impregnating the pores of the bisque sheets with an organic binder material, forming openings through the impregnated bisque sheets, filling the openings with conductive material and imprinting conductive circuitry patterns on the surface of the impregnated bisque sheets of a conductive material, assembling the plurality of apertured printed impregnated bisque sheets into a laminated unit, and sintering the laminated unit to form a unitary laminated structure having an interconnected internal circuitry system.

REFERENCES:
patent: 2365535 (1944-12-01), Fischer
patent: 3250833 (1966-05-01), Wagner
patent: 3436451 (1969-04-01), Wasser
patent: 3540894 (1970-11-01), McIntosh
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3988405 (1976-10-01), Smith et al.

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