Method of making a multi-chip module having an improved heat dis

Details Method of making a multi-chip module having an improved heat dis Method of making a multi-chip module having an improved heat dis

1996-04-26

1997-01-14

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

26427217, 257706, 257717, H05K 330

Patent

active

055927351

ABSTRACT:
A multi-chip module includes a substrate, an interconnection pattern provided on the substrate, a plurality of semiconductor chips provided commonly upon the substrate in electrical connection with the interconnection pattern, a plurality of thermally conductive blocks each provided on corresponding one of the plurality of semiconductor chips in an intimate contact therewith, a resin package body that encapsulates the plurality of semiconductor chips and the plurality of thermally conductive blocks together with the substrate, such that the resin package body has an upper major surface substantially flush with the upper major surfaces of the plurality of thermally conductive blocks, and a heat sink mounted upon the upper major surface of the resin package body such that the heat sink establishes an intimate contact with respective upper major surfaces of the thermally conducting blocks.

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 5032897 (1991-07-01), Mansuria et al.
patent: 5065280 (1991-11-01), Karnezos et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5173844 (1992-12-01), Adachi et al.
patent: 5182853 (1993-02-01), Kobayashi et al.
patent: 5291064 (1994-03-01), Kurokawa
patent: 5339216 (1994-08-01), Lin et al.

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