Method of making a molded interconnect device

Details Method of making a molded interconnect device Method of making a molded interconnect device

2008-07-07

2011-10-11

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S831000, C029S832000

Reexamination Certificate

active

08033014

ABSTRACT:
The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.

REFERENCES:
patent: 4985601 (1991-01-01), Hagner
patent: 4996391 (1991-02-01), Schmidt
patent: 5369881 (1994-12-01), Inaba et al.
patent: 6100178 (2000-08-01), Todd et al.
patent: 6967152 (2005-11-01), Jordan et al.
patent: 2007/0247822 (2007-10-01), Naundorf
patent: 1314778 (2001-09-01), None
patent: 1209959 (2004-03-01), None
patent: 06-152098 (1994-05-01), None
patent: 07-170077 (1995-07-01), None

Affiliated with

Also associated with

Rating

Method of making a molded interconnect device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a molded interconnect device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a molded interconnect device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4275679