Method of making a molded flex circuit ball grid array

Details Method of making a molded flex circuit ball grid array Method of making a molded flex circuit ball grid array

1998-08-28

1999-11-16

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438122, 438613, 257668, 257675, H01L 2348

Patent

active

059856955

ABSTRACT:
A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes or vias in the substrate which define a contact pad array on the opposite surface. The substrates are tested and acceptable, then mounted on a carrier strip with longitudinally aligned apertures. The carrier strip is typically a metal such as copper. The strip with mounted substrates is then passed to a station where an IC die is mounted on the substrate first surface, wire bonds are placed from the die to the bonding pads, and the assembly is encapsulated by auto-molding to form a package body. Subsequently, interconnecting bumps are placed on the contact pads and the assembly is removed from the strip.

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5506756 (1996-04-01), Haley
patent: 5581122 (1996-12-01), Chao et al.
patent: 5654243 (1997-08-01), Yoneda et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5701032 (1997-12-01), Fischer et al.
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5732465 (1998-03-01), Tokita et al.
patent: 5852870 (1998-12-01), Freyman et al.
patent: 5854741 (1998-12-01), Shim et al.
patent: 5905633 (1999-05-01), Shim et al.
Hattas, D., et al., "Mounting Technology of GBA-P and GBA-T", 17th IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium, Austin, Oct. 2-4, 1995, IEEE, pp. 417-421, XP000580510.
Karnezos, M., et al. "Flex Tape Ball Grid Array", 1996 Proceedings of 46th Electronic Components and Technology Conf., May 28-31, 1996 IEEE, pp. 1271-1277, XP000684990.
Schueller, Ph.D., R.D., "Design Considerations for a Reliable Low Cost Tape Ball Grid Array Package", 3M Electronic Products Division, Published in Proceedings fo IEPS Conference, San Diego, CA, Sep. 1995, pp. 1-14.
Schuller, R.D., "Design Conciderations for a Reliable Low Cost Tape Ball Grid Array Package", International Journal of Microcircuits and Electronic Packaging, Vo. 19, No. 2, Apr. 1996, pp. 146-154, XP000639477.

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