Method of making a microelectronic assembly

Details Method of making a microelectronic assembly Method of making a microelectronic assembly

2005-06-21

2005-06-21

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06908789

ABSTRACT:
A method of making a microelectronic assembly is provided. Wetting and flow characteristics of a no-low underfill material are improved by preheating the no-flow underfill material. In one embodiment, the no-flow underfill material is preheated in a dispensing apparatus before being dispensed on a substrate. A die is then placed on the substrate, whereafter interconnection elements between the die and the substrate are reflowed and the no-flow underfill material is cured. In another embodiment, the no-flow underfill material is preheated after a die is placed on a substrate with the no-flow underfill material between the die and the substrate. In a further embodiment, a no-flow underfill material is dispensed on a die, whereafter a substrate is placed on the die with the no-flow underfill material between the substrate and the die.

REFERENCES:
patent: 6180696 (2001-01-01), Wong et al.
patent: 6673649 (2004-01-01), Hiatt et al.
patent: 6794225 (2004-09-01), Manepalli et al.

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