Method of making a microaccelerometer having low stress bonds an

Details Method of making a microaccelerometer having low stress bonds an Method of making a microaccelerometer having low stress bonds an

1990-12-11

1993-06-22

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

73 57R, 73 57AV, 73DIG1, 1563073, 156329, 156630, B32B 3100

Patent

active

052214001

ABSTRACT:
A microaccelerometer is provided which has a silicon substrate bonded to a silicon capping plate and silicon back plate, wherein the bonds between the three silicon wafers are characterized by a relatively low residual stress level over a wide temperature range. The bonds are formed by means of an appropriate adhesive at a relatively low temperature without degradation to the microaccelerometer. The bonds between the silicon wafers also provide stress relief during use and packaging of the microaccelerometer. With this invention, the damping distance for the proof mass of the microaccelerometer is accurately controllable and stop means are provided for preventing excessive deflection of the proof mass in a direction perpendicular to the plane of the microaccelerometer.

REFERENCES:
patent: 4901570 (1990-02-01), Chang et al.
patent: 5060504 (1991-10-01), White et al.
patent: 5068203 (1991-11-01), Logsdon et al.
patent: 5121180 (1992-06-01), Beringhause et al.
H. V. Allen, S. C. Terry, D. W. DeBruin, "Accelerometer Systems With Self-testable Features", Sensors and Actuators, vol. 20, Nos. 1,2, pp. 153-161, Lausanne, CH, (15 Nov. 1989).

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